1. 2. 3. material content data sheet sales product name ips060n03l g issued 29. august 2013 ma# MA000707214 package pg-to251-3-311 weight* 333.79 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.985 0.30 0.30 2950 2950 leadframe non noble metal iron 7439-89-6 0.176 0.05 528 inorganic material phosphorus 7723-14-0 0.053 0.02 158 non noble metal copper 7440-50-8 175.989 52.71 52.78 527245 527931 wire non noble metal aluminium 7429-90-5 2.156 0.65 0.65 6459 6459 encapsulation organic material carbon black 1333-86-4 0.328 0.10 982 plastics epoxy resin - 19.794 5.93 59302 inorganic material silicondioxide 60676-86-0 128.932 38.63 44.66 386267 446551 leadfinish non noble metal tin 7440-31-5 3.002 0.90 0.90 8992 8992 plating inorganic material phosphorus 7723-14-0 0.004 0.00 11 non noble metal nickel 7440-02-0 1.555 0.47 0.47 4657 4668 solder noble metal silver 7440-22-4 0.020 0.01 61 non noble metal tin 7440-31-5 0.016 0.00 49 non noble metal lead 7439-92-1 0.781 0.23 0.24 2339 2449 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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